Long-term effective protection of sensitive circuits and electronic components plays an increasingly important role in today’s sophisticated and demanding electronic applications. The silicone potting material has stable dielectric insulation and is an effective guarantee for preventing environmental pollution. At the same time, it can eliminate the stress generated by shock and vibration in a large temperature and humidity range.
1: It has small shrinkage during curing and has excellent waterproof and moisture resistance.
2: Curing at room temperature, self-discharging is good, and it is more convenient to operate.
3: Low viscosity: It has good fluidity and can penetrate into small voids and under the components.
4: Specific gravity: small specific gravity, no air bubbles
5: Good heat dissipation performance: It can effectively reduce the component temperature.
6: Corrosion: Addition curing system, no by-product formation.
7: The more insulating properties: the cured rubber has good insulation properties.
8: UV, good impact resistance, good weather resistance, anti-aging properties.
It is widely used for potting protection of high-power electronic components, module power supplies, circuit boards and LEDs; it is especially suitable for potting with adhesive properties.
Epoxy potting glue has good fluidity and easy to penetrate into the gap of the product; it can be cured at room temperature or medium temperature, and the curing speed is moderate; no bubbles after curing, smooth surface, shiny, high hardness; It is moisture-proof, waterproof, oil-proof and dust-proof. It is resistant to damp heat and atmospheric aging. It has good electrical and physical properties such as good insulation, compression resistance and high bonding strength. Common epoxy potting compounds are: flame retardant, thermal, low viscosity, high temperature resistant.
1: Both front and back are stable, easy to construct, and the state changes regularly.
2: Very good high temperature resistance and excellent chemical resistance.
3: Good adhesion on metal substrates and porous substrates.
4: Epoxy resins can be cured by a variety of curing agents, so a variety of properties can be obtained.
5: The curing agent includes amines, acids, and acid anhydrides.
1: Very sensitive, very small cracks can also be extended to the entire potting area.
2: Epoxy resin cannot be used in products with strong impact.
3: Epoxy is not recommended for PCBs of MT components, and the Tg of epoxy resins is too high. The lowest can also be 4:-22 °C. Epoxy resin
5: And some strong acids can “corrode" the cured epoxy resin. Poor repairability and higher price.
LED, automotive electronics, regulators, industrial electronics, relays, controllers, power modules, sensors
Polyurethane elastic potting material overcomes the drawbacks of common epoxy resin brittleness and low strength and poor adhesion of silicone resin. It has excellent water resistance, heat resistance, cold resistance, UV resistance, acid and alkali resistance, high and low temperature resistance. , moisture-proof, environmental protection, high cost performance, etc., is an ideal electronic component potting protection material.
1: The hardness range after curing of the ester can reach: the Tg of the polyurethane can be lower than -40 °C, so it is a good choice for PCB potting with SMT components, and the low temperature resistance is very good.
2: The gelation time of the ester can be controlled with additives that accelerate the curing without affecting the performance, so the supplier can adjust the curing speed as needed to meet the actual demand.
1: Limited performance, can be used continuously at 130 ° C, intermittent use at 150 ° C.
2: Learning performance is slightly worse than epoxy resin, can withstand the splash of chemicals, but can not stand soaking
Transformers, chokes, converters, capacitors, coils, inductors, varistors, linear engines, stationary rotors, circuit boards, electromagnets, pre-molding, LEDs, pumps, transfer switches, plugs, cable bushings, ultrafiltration components , reverse osmosis membrane module.