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clear pcb epoxy potting compound for electronics in china

SATOP®8613 epoxy potting compound for electric motor, low CTE

epoxy potting compound
epoxy potting compound
epoxy potting compound

Product description of epoxy potting compound

SATOP®8613A/B is a two-component solvent heating type epoxy potting compound,It is suitable for packaging and protection of products with high thermal conductivity requirements in motors, automotive electronics, power tools, reactors, and meters, and has excellent adhesion and temperature resistance.

  • Excellent adhesion and crack resistance
  • Low CTE linear expansion coefficient
  • High thermal conductivity
  • Excellent electrical insulation and stability
  • Long-term use at 150°C-180°C
  • Very low water absorption, good water and moisture resistance

Technical parameters before and after curing:

Before curingTest itemTest standardUnit8613A8613B
ColorBlack liquidTransparent liquid
ViscosityGB/T 10247-200825℃,mPa·s20,000±3,00025
DensityGB/T 13354-9225℃,g/cm32.35±0.050.93±0.05
Mix ratioWeight ratioRatio=A:B100:8
Mix viscosityGB/T 10247-200825℃,mPa·s2000±300
40℃,mPa·s45
60℃,mPa·s60
Operating timeGB/T 10247-200825℃,hr90
Gel timeGB/T 10247-200825℃,hr1.0
Cure timeGB/T 10247-2008hr20
After curingHardnessGB/T 531.1-200825℃,Shore D95
260℃,Shore D20,000±3,00025
Coefficient of expansionGB/T 20673-2006μm/(m,℃)2.35±0.050.93±0.05
Thermal ConductivityGB/T 10297-1998W/m.k100:8
Glass transition temperatureDSC2000±300
Shear strengthGB 6328-86Mpa,iron/iron≥8

≥8

Mpa,aluminum/aluminum≥18
Dielectric strengthGB/T 1693-2007kV/mm(25℃)0.09
Loss factorGB/T 1693-2007(1MHz)(25℃)2.9
Dielectric constantGB/T 1693-2007(1MHz)(25℃)1.00E +15
Volume resistanceGB/T 1692-92DC500V,Ω· cm-50–180

Remark:

  1. 1.The above data test curing conditions are: 1hr/120℃+1hr/150℃.
  2. 2.The data in the table is the measured data under a specific condition,For reference only, it does not guarantee that the data obtained by the customer during actual use can be completely consistent with it

Operation process of epoxy potting compound

  • PartA will settle in the storage process, first mix Part A in the original package, and then add Part A and Part B components by a weight ratio of 5:1. Potting.
  • component may crystallize or agglomerate (normal condition) during storage.If crystallized, need to be placed in an oven at 80°C to melt before use(the container should be open to avoid gas expansion and damage the container), and then used after being cooled to room temperature, this does not affect its performance.
  • B component is exposed in the air and hydrolysis occurs with the moisture reaction, and the hydrolyzedproduct is white powder. When weighing, avoid the white stuff.
  • If necessary, the potted device can continue to be vacuumed, which is beneficial to increase the electrical performance of the device.
  • 25°C*24 hours. For better performance, follow the 100°C*2 hour or 80°C*3 hour curing process.

Storage and transportation

  • A, B components need to be protected from light, heat, sealed and stored (can be transported and stored as non-dangerous goods);
  • The storage period is one year.

Packing

  • Part A:20kg/plastic barrel; Part B: 8kg or 2.4kg/pot

Product safety information is not included here. Before use, please read the product information, product safety information and packaging label for safe use. The product safety information can be obtained from SATOP and the distributor, or write to the SATOP service center [email protected] or call 021-64243697.

The technical data of this paper are all typical values obtained under laboratory conditions.We are not responsible for the results of methods beyond our control.Because users use condition is different, different material surface state, curing conditions, storage conditions, transportation and other factors can make gum stability and physical and mechanical properties, the actual performance data has some changes are normal phenomenon.Before using this product,Validation is based on the data provided in this article.If you have any problems with the process, you can contact our technical service department and we will provide you with all the help. Our company reserves the right to modify the data in this article.

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